ESEC AG

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 254
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361
 
  
 
H04R LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS 1106

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9603294 Apparatus for mounting semiconductor chipsSep 13, 12Mar 21, 17[H01L, H05K]
9082816 Method and apparatus for mounting semiconductor chipsJul 02, 12Jul 14, 15[H01L, H05K]
8715457 Method for detaching and removing a semiconductor chip from a foilNov 03, 09May 06, 14[B32B]
8573467 Method for dispensing solder on a substrate and method for mounting semiconductor chipsMay 17, 12Nov 05, 13[B23K]
8250742 Die ejectorNov 03, 09Aug 28, 12[B23P]
8166637 Apparatus for mounting a flip chip on a substrateJan 25, 08May 01, 12[B23P]
8106564 Ultrasonic transducerMar 20, 08Jan 31, 12[H04R]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2010/0315,655 Method And Device For Measuring A Height DifferenceAbandonedNov 19, 07Dec 16, 10[G01B]
2010/0233,369 Method Of Forming A Paste PatternAbandonedFeb 12, 10Sep 16, 10[B05D]

Top Inventors for This Owner

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